LOOP
LOOP // INDEPENDENT DESIGN ENGINEERING
SPECIALTY: PHYSICAL PRODUCT DEVELOPMENT
PHYSICAL HARDWARE // DIRECT COLLABORATION

WE TURN PHYSICAL
PRODUCT IDEAS INTO
PRODUCTION CAD & 3D.

LOOP is an independent design engineering studio. We create the 3D CAD files, engineering blueprints, exploded diagrams, and photorealistic visuals required to manufacture physical products—from consumer devices and electronics to robotics and packaging.

01 / WHAT WE ENGINEER
Physical Hardware & Devices
02 / CORE ASSETS
CAD (.STEP) + Blueprints + BOM
03 / FABRICATION
Digital Handoff for Factories
04 / STRUCTURE
Independent Solo Studio
02STUDIO PURPOSE

FROM NAPKIN SKETCHES TO FACTORY-READY CAD.

We take physical product concepts—smartphones, laptops, drones, robotics, packaging—and engineer the exact 3D models, manufacturing blueprints, and tooling data required to fabricate them.

01

PHYSICAL IDEA

Your napkin sketch, circuit board bounds, or hardware concept.

02

FORM & ERGONOMICS

Sculpting the outer shell to fit the human hand and internal parts.

03

PARAMETRIC CAD

Production 3D geometry with mold draft angles and rib structures.

04

ASSEMBLY & KINEMATICS

Interference collision checks, hinges, latches, and screws.

05

FACTORY BLUEPRINTS

ASME Y14.5 2D drawings with GD&T datums ready for machine shops.

03SIGNATURE TRANSFORMATION

THE LOOP METHOD: WATCHING A PRODUCT COME TO LIFE.

Watch a physical product come into existence digitally. Scrub through the 7 distinct phases of our engineering lifecycle: from initial sketch contours to solid CAD, exploded assembly, and manufacturing blueprint.

SIGNATURE INTERACTIONDIGITAL PRODUCT TRANSFORMATION // 01 → 07
ACTIVE PIPELINE: SKETCH // 3D RENDER ENGINE
01
Product Form Exploration

DIGITAL SKETCH & SILHOUETTE

Translating napkin sketches and volumetric requirements into clean 3D spatial contour envelopes.

ENGINEERING SPECIFICATION
POLYGON COUNT: 1,200 // AXIAL CONTOUR SPACING: 10mm
OUTPUT FILE:CONCEPT-ENVELOPE.OBJ
SELECT TRANSFORMATION PHASE
04INTERNAL HARDWARE EXPLORATIONS

SELECTED CONCEPTS.

Speculative hardware designs developed internally to demonstrate our CAD, Class-A surface modeling, thermal architecture, and blueprint capabilities. Every project has its own bespoke 3D CAD model.

EXPLORE ALL 6 HARDWARE CONCEPTS
CONCEPT 001|Smartphone
SPECULATIVE
MATERIAL: Grade 5 Titanium (Ti-6Al-4V) & Zirconia Ceramic
INSPECT 3D CAD
Industrial Design / Surface Modeling / CADConsumer Electronics

AETHER / ONE

IN PLAIN ENGLISH:A titanium unibody smartphone engineered with internal vapor-chamber cooling, triple camera housing, and zero-bezel acoustic sound.
DIMENSIONS:148.4 × 71.2 × 7.35 mm
TOLERANCE:±0.025 mm CNC datum registry
VIEW SMARTPHONE ARCHITECTURE
CONCEPT 002|Aerospace Reconnaissance Drone
SPECULATIVE
MATERIAL: Toray T1000 Carbon Fiber Prepreg & Rohacell Core
INSPECT 3D CAD
Aerodynamic Form / Engineering Schematics / BlueprintAerospace Systems

STRATOS / X1

IN PLAIN ENGLISH:A high-altitude stealth drone aircraft designed with aerodynamic carbon-fiber wings and ducted fan propulsion.
DIMENSIONS:Wingspan 1,840 mm × Length 760 mm × Height 142 mm
TOLERANCE:Airfoil contour accuracy ±0.15 mm
VIEW AEROSPACE RECONNAISSANCE DRONE ARCHITECTURE
CONCEPT 003|Performance Laptop
SPECULATIVE
MATERIAL: 6063-T6 CNC Aluminum & Copper-Nickel Sinter
INSPECT 3D CAD
Mechanical Architecture / Assemblies / Thermal CADHardware / Compute

APEX / STUDIO

IN PLAIN ENGLISH:A high-performance aluminum laptop with an open display clamshell, dual vapor chambers, and a zero-wobble friction hinge.
DIMENSIONS:312.0 × 218.5 × 13.8 mm
TOLERANCE:CNC perimeter gap ±0.03 mm
VIEW PERFORMANCE LAPTOP ARCHITECTURE
CONCEPT 004|Protein Powder Container
SPECULATIVE
MATERIAL: Post-Consumer PCR-HDPE & Food-Grade Silicone
INSPECT 3D CAD
Packaging Design / CMF / Product VisualizationFood & Nutrition Packaging

KURA / CELL

IN PLAIN ENGLISH:An airtight protein powder container with a quarter-turn twist lock bayonet lid and magnetic docking scoop.
DIMENSIONS:Diameter 118.0 mm × Height 192.0 mm
TOLERANCE:Thread engagement tolerance ±0.08 mm
VIEW PROTEIN POWDER CONTAINER ARCHITECTURE
CONCEPT 005|Biometric Wristband
SPECULATIVE
MATERIAL: Fluoroelastomer (FKM) & Grade 5 Titanium
INSPECT 3D CAD
Ergonomics / CMF / Mechanism VisualizationWearable Device

SYNAPSE / BAND

IN PLAIN ENGLISH:A medical-grade biometric wristband that measures arterial pulse waves through dry titanium sensor contacts.
DIMENSIONS:Band width 22.0 mm × Core thickness 5.2 mm
TOLERANCE:Electrode sensor seating ±0.015 mm
VIEW BIOMETRIC WRISTBAND ARCHITECTURE
CONCEPT 006|Cycloidal Robotic Joint Actuator
SPECULATIVE
MATERIAL: 4340 Alloy Steel, 7075-T6 Aluminum, Silicon Nitride
INSPECT 3D CAD
Kinematics / Mechanism Design / Exploded ViewsRobotics & Automation

AXON / JOINT 01

IN PLAIN ENGLISH:A heavy-duty cycloidal robotic joint actuator built with zero-backlash gearing for high-torque robotic arms.
DIMENSIONS:Diameter 94.0 mm × Depth 58.0 mm (Hollow bore: 22.0 mm)
TOLERANCE:Cycloid pin profile tolerance ±0.005 mm (5 microns)
VIEW CYCLOIDAL ROBOTIC JOINT ACTUATOR ARCHITECTURE
05CORE DISCIPLINES

STUDIO CAPABILITIES.

Hover or tap any discipline to inspect live engineering blueprints, CAD tolerances, and deliverable standards.

01

PRODUCT CONCEPT DESIGN

Translating physical product ideas into manufacturable form directions, aesthetic systems, and functional ergonomics.

+ Form exploration+ Design directions+ Ergonomic studies+ 3D concept development+ Silhouette validation
SPECIFICATION: SURFACE CONTINUITY G2/G3 // FORM STUDY REV 04
02

CAD & 3D SOLID MODELING

Production-intent solid and parametric surface modeling built for machine shops, mold makers, and engineering handoff.

03

PRODUCT VISUALIZATION

Photorealistic digital imagery, studio lighting studies, and cinematic beauty visuals before cutting physical tooling.

04

TECHNICAL DRAWINGS

Rigorous 2D engineering blueprints with GD&T, datum structures, orthographic projections, and critical fit callouts.

05

ENGINEERING DIAGRAMS

Clear visual breakdowns of internal mechanisms, exploded assemblies, electrical routing, and mechanical kinematics.

06

DIGITAL PROTOTYPING

Stress-testing physical product forms, mechanical interferences, and volume constraints digitally before committing to tooling.

07

ENGINEERING DOCUMENTATION

Organized, professional handoff packages that allow clients, factories, and prototyping vendors to manufacture with confidence.

TERMINAL // CAPABILITY AUDIT
INDEX: 01 / 07
REAL-TIME VECTOR SCHEMA // CONCEPT ARCHITECTURE
[X: 0.00 Y: 0.00 Z: 1.00]
TOLERANCE: ±0.025mm
DISCIPLINE
PRODUCT CONCEPT DESIGN
DELIVERABLES INCLUDED
  • Form exploration
  • Design directions
  • Ergonomic studies
  • 3D concept development
  • Silhouette validation
EXPLORE PRODUCT CONCEPT DESIGN
06DELIVERABLE ROADMAP

WHAT CLIENTS RECEIVE: THE COMPLETE CAD SYSTEM.

Every physical product idea passes through our structured digital engineering layer, resulting in production-ready files (.STEP, .DWG, .PDF, BOM) for your manufacturing partners.

01

PHYSICAL IDEA

Napkin sketch, internal board constraints, or hardware concept.

02

3D FORM ENVELOPE

Ergonomic volumetric studies, human factor grip, silhouette balance.

03

SURFACE LOFTS

Class-A curvature continuity (G2/G3), parting line placement.

04

SOLID CAD

Parametric SolidWorks solids, 1.5° tooling draft, uniform wall thickness.

05

MECHANISMS

Internal packaging, zero-clash assemblies, kinematic mating.

06

2D BLUEPRINTS

ASME Y14.5 manufacturing drawings, GD&T datums A/B/C, BOM.

07

FACTORY HANDOFF

Production archive (.STEP, .DWG, .PDF) ready for tooling quotes.

07STUDIO LAB

THE ENGINEERING LAB.

Enter LOOP's digital workspace: explore CAD solid feature trees, 2D orthographic blueprints with GD&T, exploded sub-assemblies, and CMF finish studies.

ENGINEERING LAB // DIGITAL WORKSPACE SIMULATOR
KERNEL: SIEMENS PARASOLID // 64-BIT PRECISION
COORDINATES: [X: 0.00 Y: 0.00 Z: 0.00]
DATUM A // PRIMARY CHASSIS
|UNITS: METRIC (MM)
ISO 9001 VERIFIED DIGITAL PIPELINE
TELEMETRY & VALIDATION
DIGITAL SYSTEM INTEGRITY
NOMINAL WALL THICKNESS
1.25 mmVALIDATED
MOLD DRAFT ANGLE
1.50° MINTOOL READY
CURVATURE CONTINUITY
CLASS-A / G3ZERO STRIPE FAULT
ASSEMBLY CLEARANCE
0.35 mm AIR GAPZERO CLASH
MATERIAL DENSITY
4.43 g/cm³ (TI-6AL-4V)FEA LINKED
TOTAL DRY MASS
172.4 gOPTIMIZED
ZERO RISK DIGITAL HANDOFF

Every part is mathematically verified in CAD before factory release. Tooling errors are caught digitally, saving tens of thousands in prototype re-spins.

08AUTHENTIC DIFFERENTIATION

WHY HARDWARE FOUNDERS WORK WITH LOOP.

No empty corporate buzzwords. Concrete technical differences that protect your tooling capital and accelerate physical manufacturing.

01

DIRECT COLLABORATION

Work directly with the design engineer authoring your SolidWorks CAD. No account managers and zero translation loss.

02

TOOLING-READY RIGOR

Every surface is built with production intent: draft angles, nominal wall checks, tooling release planes, and ISO 2768 tolerances.

03

VISUAL CLARITY

Transform complex 50-part mechanical assemblies into intuitive exploded diagrams and 8K renders that investors and factories instantly understand.

04

COMPLETE ASSET OWNERSHIP

You receive clean, organized, 100% owned digital archives (.STEP, .DWG, .PDF, BOM) ready for quotation and tooling anywhere in the world.

09METHODOLOGY

THE 6-PHASE DEVELOPMENT PROCESS.

From constraint discovery to digital handoff. Clear milestones, transparent reviews, and zero ambiguity.

EXPLORE FULL PROCESS GUIDE
01 // PHASE

DISCOVER

Catalog electronic volumes, batteries, and mechanical constraints.

02 // PHASE

DEFINE

Establish form language, proportion studies, and master datum spines.

03 // PHASE

DESIGN

Sculpt Class-A curvature surfaces, parting lines, and tactile CMF.

04 // PHASE

ENGINEER

Build parametric SolidWorks CAD, ribs, bosses, and zero-clash assemblies.

05 // PHASE

VISUALIZE

Render 8K photorealistic studio visuals and internal cutaways.

06 // PHASE

DELIVER

Hand off organized archive (.STEP, .DWG, .PDF, BOM) ready for tooling.

ONE STUDIO // DIRECT COLLABORATION

NO ACCOUNT MANAGERS.
DIRECT ENGINEERING.

LOOP is an independent design engineering studio. Projects are handled directly by the designer-engineer rather than passed through layers of agency bureaucracy or outsourced overseas.

Single point of technical contact
Rapid parametric design iteration
100% intellectual property transfer
Strict NDA confidentiality
11SECTOR CAPABILITIES

PHYSICAL INDUSTRIES SERVED.

LOOP develops 3D CAD and engineering packages across physical hardware domains.

IND-01
CONSUMER ELECTRONICS
Smartphones, audio gear, smart home controllers, handhelds
IND-02
AEROSPACE & DEFENSE
UAV airframes, instrument pods, aerostructures, telemetry enclosures
IND-03
AUTOMOTIVE & MOBILITY
Cockpit hardware, EV charging interfaces, aerodynamic components
IND-04
ROBOTICS & AUTOMATION
Joint actuators, end-effectors, chassis frames, sensor mounts
IND-05
WEARABLES & BIO-TECH
Haptic bands, biosensing wearables, ergonomic medical housings
IND-06
SPORTS & OUTDOOR
Technical performance gear, protective equipment, ruggedized modules
IND-07
HEALTH & WELLNESS
Diagnostic hand tools, therapy devices, laboratory enclosures
IND-08
FOOD & NUTRITION
Dosing packaging, precision dispensing closures, structural canisters
IND-09
HARDWARE & TOOLS
Handheld power tools, measurement instruments, industrial devices
IND-10
EMERGING TECHNOLOGY
Quantum compute modules, spatial computing hardware, AI appliances
DIRECT INTAKE // 2026 CALENDAR OPEN

BRING US
THE PHYSICAL IDEA.

Have a physical product concept, device, mechanism, or hardware idea? LOOP turns it into a precise, production-ready 3D CAD and engineering system.